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Glass Chips & Photon Computing: Advanced Semiconductor Packaging, Optical Interconnects, and the Future of AI Hardware

300.00

The semiconductor industry is reaching the limits of traditional silicon scaling. As AI workloads explode and data movement becomes the new bottleneck, innovation is shifting from smaller transistors to smarter system architecture.

This book explores how glass substrate technology and photon-based computing are reshaping the future of advanced packaging, chiplet integration, and high-speed optical interconnects. From Through-Glass Via (TGV) engineering to hybrid electro-optical architectures, this guide presents a deep academic and industry-level analysis of the technologies driving next-generation intelligent machines.

Ideal for engineers, researchers, semiconductor professionals, AI hardware developers, and technology strategists.

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The future of computing will not be defined by smaller silicon transistors alone. It will be defined by integration, materials innovation, and light-speed communication.

Glass Chips & Photon Computing delivers a comprehensive, academically rigorous exploration of the technologies transforming semiconductor architecture. As Moore’s Law slows and power density constraints intensify, advanced packaging has become the new frontier of performance scaling. Glass substrates are emerging as a powerful alternative to organic laminates and silicon interposers, enabling ultra-fine routing, reduced warpage, improved signal integrity, and optical integration capabilities.

At the same time, photon-based interconnects and silicon photonics are redefining data movement efficiency. Optical communication promises lower energy per bit, higher bandwidth density, and reduced thermal limitations—critical for AI accelerators, high-performance computing, and next-generation data centers.

This book provides:

• A deep analysis of the physical limits of silicon scaling
• Fundamentals of advanced semiconductor packaging
• Glass substrate material science and Through-Glass Via (TGV) fabrication
• High-bandwidth memory integration and chiplet architectures
• Fundamentals of photonics and optical waveguides
• Hybrid electro-optical system design
• Performance comparisons between electrical and optical interconnects
• Manufacturing challenges and cost considerations
• Strategic implications for global semiconductor ecosystems

Written in a structured academic format, this book bridges material science, electrical engineering, and emerging photonic computing paradigms.

Who Should Read This Book?

• Semiconductor engineers and packaging specialists
• AI hardware architects
• Electrical and electronics engineering students
• Photonics researchers
• Technology investors and strategic planners
• Policymakers interested in semiconductor development

As computing shifts from transistor scaling to system-level innovation, understanding glass substrates and photon computing is essential. This book equips you with the technical foundation and forward-looking perspective needed to navigate the next era of intelligent machines.

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